TY - JOUR
T1 - Ultrathin adhesive layer between LiNbO3 and SiO2 for bonded LNOI waveguide applications
AU - Takigawa, Ryo
AU - Higurashi, Eiji
AU - Asano, Tanemasa
N1 - Funding Information:
This work was supported in part by Kakenhi Grants-in-Aid (JP18K18863) from the Japan Society for the Promotion of Science (JSPS). The authors would like to acknowledge Mitsubishi Heavy Industries Machine Tool Co., Ltd. for assistance with the surface-activated bonding experiments, and Mr. Michitaka Yamamoto at the University of Tokyo for useful discussion.
Publisher Copyright:
© 2019 The Japan Society of Applied Physics.
PY - 2019
Y1 - 2019
N2 - A RT wafer bonding method for waveguide applications was investigated using an ultrathin Fe intermediate adhesive layer between LiNbO3 (LN) and SiO2 wafers. Here we focus on the optimal amounts of Fe in this layer to minimize the propagation losses of the resultant LN on-insulator (LNOI) waveguide. A sub-nanometer-thick Fe-containing intermediate layer exhibited strong bonding strength (surface energy: >1 J m-2) at RT, which may be sufficient for device applications. The influence of the Fe intermediate layer on the propagation loss of light through the LNOI waveguide was also investigated using numerical calculations. The present study is expected to be a significant contribution to the development of fabrication techniques for waveguides composed of various materials to be bonded by this RT bonding method using a metal intermediate adhesive layer.
AB - A RT wafer bonding method for waveguide applications was investigated using an ultrathin Fe intermediate adhesive layer between LiNbO3 (LN) and SiO2 wafers. Here we focus on the optimal amounts of Fe in this layer to minimize the propagation losses of the resultant LN on-insulator (LNOI) waveguide. A sub-nanometer-thick Fe-containing intermediate layer exhibited strong bonding strength (surface energy: >1 J m-2) at RT, which may be sufficient for device applications. The influence of the Fe intermediate layer on the propagation loss of light through the LNOI waveguide was also investigated using numerical calculations. The present study is expected to be a significant contribution to the development of fabrication techniques for waveguides composed of various materials to be bonded by this RT bonding method using a metal intermediate adhesive layer.
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U2 - 10.7567/1347-4065/ab24b6
DO - 10.7567/1347-4065/ab24b6
M3 - Article
AN - SCOPUS:85072833966
SN - 0021-4922
VL - 58
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
IS - SJ
M1 - SJJE06
ER -