Ultrasonic angle beam technique for NDE of adhesive strength of thin film

Kiyoshi Hoshikawa, Masumi Saka, Hirouiki Abe, Hidek Fujita, Ysohito Izumi

Research output: Contribution to conferencePaperpeer-review

1 Citation (Scopus)

Abstract

NDE of the adhesive strength of diamond film to Si substrate is treated by using ultrasonic angle beam technique. The relation between the nucleation density of the film and the adhesive strength is focused. Model specimens with different values of the adhesive strength are prepared by controlling the nucleation density and are offered for observation and experimental analysis of the transmitted wave. From spectra obtained by fast Fourier transform, the characteristic is found such that the amplitude of the spectrum takes higher value with increasing adhesive strength. This phenomenon is explained theoretically by considering the difference in transmissibility for the shear stress at the interface between the film and substrate, which is reflecting the difference in the nucleation density and hence the difference in the adhesive strength.

Original languageEnglish
Pages443-447
Number of pages5
Publication statusPublished - 1993 Dec 1
EventProceedings of the 1993 ASME International Electronics Packaging Conference - Binghamton, NY, USA
Duration: 1993 Sep 291993 Oct 2

Other

OtherProceedings of the 1993 ASME International Electronics Packaging Conference
CityBinghamton, NY, USA
Period93/9/2993/10/2

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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