Abstract
NDE of the adhesive strength of diamond film to Si substrate is treated by using ultrasonic angle beam technique. The relation between the nucleation density of the film and the adhesive strength is focused. Model specimens with different values of the adhesive strength are prepared by controlling the nucleation density and are offered for observation and experimental analysis of the transmitted wave. From spectra obtained by fast Fourier transform, the characteristic is found such that the amplitude of the spectrum takes higher value with increasing adhesive strength. This phenomenon is explained theoretically by considering the difference in transmissibility for the shear stress at the interface between the film and substrate, which is reflecting the difference in the nucleation density and hence the difference in the adhesive strength.
| Original language | English |
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| Pages | 443-447 |
| Number of pages | 5 |
| Publication status | Published - 1993 Dec 1 |
| Event | Proceedings of the 1993 ASME International Electronics Packaging Conference - Binghamton, NY, USA Duration: 1993 Sept 29 → 1993 Oct 2 |
Other
| Other | Proceedings of the 1993 ASME International Electronics Packaging Conference |
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| City | Binghamton, NY, USA |
| Period | 93/9/29 → 93/10/2 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering