Ultracompact Silicon Wafer Packaging of Deep UV LED with Excellent Cooling Performance and Light Utilization Efficiency

Hirofumi Chiba, Yukio Suzuki, Yoshiaki Yasuda, Mitsuyasu Kumagai, Takaaki Koyama, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports a deep-UV LED (DUV-LED) package based on silicon MEMS process technology (Si-PKG). The package consists of a cavity formed by silicon crystalline anisotropic etching, through-silicon vias (TSVs) filled with electroplated Cu, bonding metals made of electroplated Ni/AuSn and a quartz lid for hermetic sealing. A DUV-LED die is directly mounted in the Si-PKG by AuSn eutectic bonding without a submount. It has merits in terms of size, heat dissipation, light utilization efficiency, productivity and cost over conventional AlN ceramic packages. Uniform light emission at an optical output of 30 mW and effective reflection on Si (111) slopes in the Si-PKG were observed.

Original languageEnglish
Title of host publication33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1310-1313
Number of pages4
ISBN (Electronic)9781728135809
DOIs
Publication statusPublished - 2020 Jan
Event33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 - Vancouver, Canada
Duration: 2020 Jan 182020 Jan 22

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2020-January
ISSN (Print)1084-6999

Conference

Conference33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
CountryCanada
CityVancouver
Period20/1/1820/1/22

Keywords

  • Deep ultraviolet LED
  • Hermetic sealing
  • Through-silicon via (TSV)
  • Wafer-level packaging

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Ultracompact Silicon Wafer Packaging of Deep UV LED with Excellent Cooling Performance and Light Utilization Efficiency'. Together they form a unique fingerprint.

Cite this