Ultra-low dielectric properties of porous polyimide thin films fabricated by using the two kinds of templates with different particle sizes

Yumi Kourakata, Tsunenobu Onodera, Hitoshi Kasai, Hiroshi Jinnai, Hidetoshi Oikawa

Research output: Contribution to journalArticlepeer-review

Abstract

Porous polyimide (PI) thin films have been fabricated successfully by using silica microparticles (MPs) with different particle sizes as a template, and the three dimensional porous structure has been observed clearly by mean of transmission electron microtomography. The measured values of dielectric constant (ε) decreased remarkably by introducing a porous structure, compared with ordinary PI thin films. Especially, the porosity evidently increased (ca. 10%) by suitably employing silica MPs having different particle sizes, and then the value of ε was further reduced. Bruggeman model could reproduce nearly the relationship between the value of ε and porosity.

Original languageEnglish
Article number123115
JournalPolymer
Volume212
DOIs
Publication statusPublished - 2021 Jan 6

Keywords

  • Bruggeman model
  • Dielectric constant
  • Electron tomography
  • Polyamic acid
  • Polyimide
  • Porosity
  • Porous structure
  • Silica microparticles

ASJC Scopus subject areas

  • Organic Chemistry
  • Polymers and Plastics
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Ultra-low dielectric properties of porous polyimide thin films fabricated by using the two kinds of templates with different particle sizes'. Together they form a unique fingerprint.

Cite this