@inproceedings{b47ce2bc260c4933ba782dbe21011d4e,
title = "Ultra-high heat flux cooling characteristics of cryogenic micro-solid nitrogen particles and its application to semiconductorwafer cleaning technology",
abstract = " The ultra-high heat flux cooling characteristics and impingement behavior of cryogenic micro-solid nitrogen (SN 2 ) particles in relation to a heated wafer substrate were investigated for application to next generation semiconductor wafer cleaning technology. The fundamental characteristics of cooling heat transfer and photoresist removal-cleaning performance using micro-solid nitrogen particulate spray impinging on a heated substrate were numerically investigated and experimentally measured by a new type of integrated computational-experimental technique. This study contributes not only advanced cryogenic cooling technology for high thermal emission devices, but also to the field of nano device engineering including the semiconductor wafer cleaning technology. ",
keywords = "Atomization, Heat transfer, Multiphase flow, Solid nitrogen particle, Thermomechanical effect, Wafer cleaning",
author = "Jun Ishimoto and U. Oh and Zhao Guanghan and Tomoki Koike and Naoya Ochiai",
year = "2014",
month = jan,
day = "1",
doi = "10.1063/1.4860828",
language = "English",
series = "AIP Conference Proceedings",
publisher = "American Institute of Physics Inc.",
pages = "1099--1106",
editor = "Susan Breon and Jennifer Marquardt and Thomas Peterson and Michael DiPirro and John Pfotenhauer and Jonathan Demko and James Fesmire and Arkadiy Klebaner and Sidney Yuan and Al Zeller and Peter Kittel and Gregory Nellis and Mark Zagarola",
booktitle = "Advances in Cryogenic Engineering - Transactions of the Cryogenic Engineering Conference - CEC, Volume 59",
note = "2013 Joint Cryogenic Engineering and International Cryogenic Materials Conferences, CEC/ICMC 2013 ; Conference date: 17-06-2013 Through 21-06-2013",
}