Abstract
The ultra-high heat flux cooling characteristics and impingement behavior of cryogenic micro-solid nitrogen (SN 2 ) particles in relation to a heated wafer substrate were investigated for application to next generation semiconductor wafer cleaning technology. The fundamental characteristics of cooling heat transfer and photoresist removal-cleaning performance using micro-solid nitrogen particulate spray impinging on a heated substrate were numerically investigated and experimentally measured by a new type of integrated computational-experimental technique. This study contributes not only advanced cryogenic cooling technology for high thermal emission devices, but also to the field of nano device engineering including the semiconductor wafer cleaning technology.
Original language | English |
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Title of host publication | Advances in Cryogenic Engineering - Transactions of the Cryogenic Engineering Conference - CEC, Volume 59 |
Editors | Susan Breon, Jennifer Marquardt, Thomas Peterson, Michael DiPirro, John Pfotenhauer, Jonathan Demko, James Fesmire, Arkadiy Klebaner, Sidney Yuan, Al Zeller, Peter Kittel, Gregory Nellis, Mark Zagarola |
Publisher | American Institute of Physics Inc. |
Pages | 1099-1106 |
Number of pages | 8 |
ISBN (Electronic) | 9780735412019 |
DOIs | |
Publication status | Published - 2014 Jan 1 |
Event | 2013 Joint Cryogenic Engineering and International Cryogenic Materials Conferences, CEC/ICMC 2013 - Anchorage, United States Duration: 2013 Jun 17 → 2013 Jun 21 |
Publication series
Name | AIP Conference Proceedings |
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Volume | 1573 |
ISSN (Print) | 0094-243X |
ISSN (Electronic) | 1551-7616 |
Conference
Conference | 2013 Joint Cryogenic Engineering and International Cryogenic Materials Conferences, CEC/ICMC 2013 |
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Country | United States |
City | Anchorage |
Period | 13/6/17 → 13/6/21 |
Keywords
- Atomization
- Heat transfer
- Multiphase flow
- Solid nitrogen particle
- Thermomechanical effect
- Wafer cleaning
ASJC Scopus subject areas
- Physics and Astronomy(all)