Ultra-high heat flux cooling characteristics of cryogenic micro-solid nitrogen particles and its application to semiconductorwafer cleaning technology

Jun Ishimoto, U. Oh, Zhao Guanghan, Tomoki Koike, Naoya Ochiai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The ultra-high heat flux cooling characteristics and impingement behavior of cryogenic micro-solid nitrogen (SN 2 ) particles in relation to a heated wafer substrate were investigated for application to next generation semiconductor wafer cleaning technology. The fundamental characteristics of cooling heat transfer and photoresist removal-cleaning performance using micro-solid nitrogen particulate spray impinging on a heated substrate were numerically investigated and experimentally measured by a new type of integrated computational-experimental technique. This study contributes not only advanced cryogenic cooling technology for high thermal emission devices, but also to the field of nano device engineering including the semiconductor wafer cleaning technology.

Original languageEnglish
Title of host publicationAdvances in Cryogenic Engineering - Transactions of the Cryogenic Engineering Conference - CEC, Volume 59
EditorsSusan Breon, Jennifer Marquardt, Thomas Peterson, Michael DiPirro, John Pfotenhauer, Jonathan Demko, James Fesmire, Arkadiy Klebaner, Sidney Yuan, Al Zeller, Peter Kittel, Gregory Nellis, Mark Zagarola
PublisherAmerican Institute of Physics Inc.
Pages1099-1106
Number of pages8
ISBN (Electronic)9780735412019
DOIs
Publication statusPublished - 2014
Event2013 Joint Cryogenic Engineering and International Cryogenic Materials Conferences, CEC/ICMC 2013 - Anchorage, United States
Duration: 2013 Jun 172013 Jun 21

Publication series

NameAIP Conference Proceedings
Volume1573
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference2013 Joint Cryogenic Engineering and International Cryogenic Materials Conferences, CEC/ICMC 2013
Country/TerritoryUnited States
CityAnchorage
Period13/6/1713/6/21

Keywords

  • Atomization
  • Heat transfer
  • Multiphase flow
  • Solid nitrogen particle
  • Thermomechanical effect
  • Wafer cleaning

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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