Ultra-compact and light weight intelligent power semiconductor module for hybrid system

Hiromichi Gohara, Akira Morozumi, Takeshi Ichimura, Yoshitaka Nishimura, Keiichi Higuchi, Peter Dietrich, Akira Nishiura, Yoshikazu Takahashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Recently, hybrid electric vehicles are required high power with high fuel efficiency and comfortable large cabin space. An ultra compact intelligent power module for two-motor hybrid electric vehicles which integrates one back-boost chopper and an inverter for a traction motor, an inverter for a power generator has been developed. The module is the world's first released module which has a direct liquid cooling structure with a solder-joined aluminium heat sink. The module achieves a 30-% reduction of volume and a 60-% reduction of weight compared to our conventional models. A heat sink with high cooling capacity and a high-strength solder were newly developed to establish the structure. The module is designed for 700 V/ 400 kVA system and it has an on-chip self protection functions and serial communication interface with a master control unit.

Original languageEnglish
Title of host publication2013 World Electric Vehicle Symposium and Exhibition, EVS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479938322
DOIs
Publication statusPublished - 2014 Oct 1
Externally publishedYes
Event27th World Electric Vehicle Symposium and Exhibition, EVS 2014 - Barcelona, Spain
Duration: 2013 Nov 172013 Nov 20

Publication series

Name2013 World Electric Vehicle Symposium and Exhibition, EVS 2014

Other

Other27th World Electric Vehicle Symposium and Exhibition, EVS 2014
CountrySpain
CityBarcelona
Period13/11/1713/11/20

Keywords

  • aluminium heat sink
  • direct liquid cooling
  • intelligent power module
  • solder joining

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Automotive Engineering
  • Fuel Technology

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