Two-dimensional analysis of carrier distribution in phosphorus-implanted emitter and phosphorus-diffused emitter using super-higher-order scanning nonlinear dielectric microscopy

Kotaro Hirose, Katsuto Tanahashi, Hidetaka Takato, Norimichi Chinone, Yasuo Cho

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Two-dimensional carrier distributions in phosphorus (P)-implanted emitter and P-diffused emitter were analyzed using super-higher-order scanning nonlinear dielectric microscopy (SHO-SNDM). The carrier distribution was clearly visualized and quantified using calibration sample. P-type, n-type and depletion layer was discriminated from local capacitance- voltage characterization obtained from SHO-SNDM measurement. The n-type region and depletion layer distribution depended on the surface texture. The position of p-n junction was estimated near the p-type region in depletion layer. The n-type region and depletion layer distribution was thicker in P- implanted emitter than P-diffused emitter.

Original languageEnglish
Title of host publication2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-4
Number of pages4
ISBN (Electronic)9781509056057
DOIs
Publication statusPublished - 2017
Event44th IEEE Photovoltaic Specialist Conference, PVSC 2017 - Washington, United States
Duration: 2017 Jun 252017 Jun 30

Publication series

Name2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017

Other

Other44th IEEE Photovoltaic Specialist Conference, PVSC 2017
Country/TerritoryUnited States
CityWashington
Period17/6/2517/6/30

Keywords

  • Capacitance
  • Diffusion process
  • Doping
  • Ion implantation
  • Scanning nonlinear dielectric microscopy
  • Scanning probe microscopy
  • Semiconductor
  • Silicon
  • Surface texture

ASJC Scopus subject areas

  • Renewable Energy, Sustainability and the Environment
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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