Tribological effects of brush scrubbing in post-CMP cleaning on the electrical characteristics in the novel non-porous low-k dielectric on Cu interconnects

Xun Gu, Takenao Nemoto, Yugo Tomita, Akinobu Teramoto, Shigetoshi Sugawa, Tadahiro Ohmi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Tribrological studes of brush scrubbing in post CMP clean for non-porous low-k dielectric fluorocarbon / Cu interconnect were carried out. Variation of leakage current and capacitance was investigated before and after various conditions of brush scrubbing. A optimum scrubbing condition in terms of reduction of damage on fluorocarbon was found to be low down pressure with high brush rotation rate.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference 2010
Pages300-301
Number of pages2
Publication statusPublished - 2010 Dec 1
EventAdvanced Metallization Conference 2010 - Albany, NY, United States
Duration: 2010 Oct 52010 Oct 7

Other

OtherAdvanced Metallization Conference 2010
CountryUnited States
CityAlbany, NY
Period10/10/510/10/7

ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

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