Trends of conductive adhesives in electronics

Katsuaki Suganuma, Daisuke Shindo, Kanji Ohtsuka, Yoshiharu Kariya

    Research output: Contribution to journalArticlepeer-review

    3 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)79-85
    Number of pages7
    JournalJournal of Japan Institute of Electronics Packaging
    Issue number1
    Publication statusPublished - 2009 Jan

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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