Treatment of the wall materials of extremely high vacuum chamber for dynamical surface analysis

Katsuyuki Tsukui; Ryu Hasunuma; Kazuhiko Endo; Toshiaki Osaka; Iwao Ohdomari

doi:10.1116/1.578746

Treatment of the wall materials of extremely high vacuum chamber for dynamical surface analysis

Katsuyuki Tsukui, Ryu Hasunuma, Kazuhiko Endo, Toshiaki Osaka, Iwao Ohdomari

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Abstract

In order to investigate the surface structure dynamically reducing the influence of the residential molecules upon the surface, the way to observe the surfaces under the extremely high vacuum (XHV; >10^-12 Torr) condition has been discussed. We proposed to combine the two processes, electrochemically polishing and high temperature baking, in order to reduce the outgassing rate of the wall material. We have characterized the inner surfaces of the stainless steel chamber processed by two optimum ways to minimize outgassing rate, by means of surface analysis and measurements of gas emission rate. We have found that in order to accomplish the XHV condition, the inner surface should be electrochemically polished after the complete baking of the material itself at 1300 K. These processes made the degassing rate of the wall lowest.

Original language	English
Pages (from-to)	417-421
Number of pages	5
Journal	Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume	11
Issue number	2
DOIs	https://doi.org/10.1116/1.578746
Publication status	Published - 1993 Mar
Externally published	Yes

ASJC Scopus subject areas

Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films

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AU - Tsukui, Katsuyuki

AU - Hasunuma, Ryu

AU - Endo, Kazuhiko

AU - Osaka, Toshiaki

AU - Ohdomari, Iwao

PY - 1993/3

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AB - In order to investigate the surface structure dynamically reducing the influence of the residential molecules upon the surface, the way to observe the surfaces under the extremely high vacuum (XHV; >10-12 Torr) condition has been discussed. We proposed to combine the two processes, electrochemically polishing and high temperature baking, in order to reduce the outgassing rate of the wall material. We have characterized the inner surfaces of the stainless steel chamber processed by two optimum ways to minimize outgassing rate, by means of surface analysis and measurements of gas emission rate. We have found that in order to accomplish the XHV condition, the inner surface should be electrochemically polished after the complete baking of the material itself at 1300 K. These processes made the degassing rate of the wall lowest.

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Treatment of the wall materials of extremely high vacuum chamber for dynamical surface analysis

Abstract

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