Transfer technology for fabrication of flexible OTFT backplane

Toshihiro Yamamoto, Yoshihide Fujisaki, Akihiro Kinoshita, Tatsuya Takei, Tadahiro Furukawa, Hideo Fujikake, Yoshiki Nakajima, Masayuki Hosoi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new transfer technology to realize flexible organic thin film transistors (OTFTs) on a plastic substrate has been developed. The basic principle of the proposed method is that all the fabrication processes for the OTFT array on glass substrate have been completed, and the OTFT is then transferred onto the plastic film. A 5.8-inch diagonal wide-QQVGA OTFT array was fabricated using this technology. We confirmed that degree of substrate deformation with the proposed technology could be suppressed in comparison with that with conventional direct formation method, and also that no significant degradation in the electrical characteristics of the OTFT was observed as a result of the transfer process. It is thought that this will be a key technology for the fabrication of large flexible displays with TFT backplanes.

Original languageEnglish
Title of host publication2011 IEEE Industry Applications Society Annual Meeting, IAS 2011
DOIs
Publication statusPublished - 2011
Externally publishedYes
Event2011 46th IEEE Industry Applications Society Annual Meeting, IAS 2011 - Orlando, FL, United States
Duration: 2011 Oct 92011 Oct 13

Publication series

NameConference Record - IAS Annual Meeting (IEEE Industry Applications Society)
ISSN (Print)0197-2618

Other

Other2011 46th IEEE Industry Applications Society Annual Meeting, IAS 2011
CountryUnited States
CityOrlando, FL
Period11/10/911/10/13

Keywords

  • Deformation rate
  • Flexible display
  • Low temperature fabrication
  • Manufacturing processes
  • Organic light emitting diodes
  • Organic thin film transistor
  • Plastic film
  • Transfer method

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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