Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding

Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Two types of high-throughput and high-precision multichip-to-wafer 3D stacking approaches are demonstrated: one is non-transfer stacking and the other one is transfer stacking. Both the stacking approaches employ a self-assembly technologies using liquid surface tension. In the former stacking scheme, large number of chips having 20-μm-square Cu/SnAg microbumps are directly self-assembled face-down on an interposer wafer, like flip-chip bonding. On the other hand, in the latter stacking scheme, the many chips having the microbumps are self-assembled face-up on a carrier wafer with bipolar electrodes for electrostatic chucking. Then, the latter chips are transferred from the carrier to another interposer in wafer-level processing. The alignment accuracies are evaluated and compared between the two stacking approaches. The resulting daisy chains show good electrical properties comparable to conventional flip-chip bonding.

Original languageEnglish
Title of host publication2015 International 3D Systems Integration Conference, 3DIC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
PagesTS7.4.1-TS7.4.4
ISBN (Electronic)9781467393850
DOIs
Publication statusPublished - 2015 Nov 20
EventInternational 3D Systems Integration Conference, 3DIC 2015 - Sendai, Japan
Duration: 2015 Aug 312015 Sep 2

Publication series

Name2015 International 3D Systems Integration Conference, 3DIC 2015

Other

OtherInternational 3D Systems Integration Conference, 3DIC 2015
CountryJapan
CitySendai
Period15/8/3115/9/2

Keywords

  • 3D Chip Stacking
  • Alignment
  • Chip-to-Wafer
  • Microbumps
  • Self-Assembly

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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