Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-To-Wafer Self-Assembly and Direct Bonding

T. Fukushima, H. Hashiguchi, H. Kino, T. Tanaka, M. Murugesan, J. Bea, H. Hashimoto, K. Lee, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Fingerprint Dive into the research topics of 'Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-To-Wafer Self-Assembly and Direct Bonding'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science