Tool wear control in diamond turning of high-strength mold materials by means of tool swinging

J. Yan; Z. Zhang; T. Kuriyagawa

doi:10.1016/j.cirp.2010.03.067

Tool wear control in diamond turning of high-strength mold materials by means of tool swinging

J. Yan, Z. Zhang, T. Kuriyagawa

MEN - Biomedical Engineering

Research output: Contribution to journal › Article › peer-review

23 Citations (Scopus)

Abstract

A tool-swinging method was proposed to reduce tool wear in diamond turning of high-strength mold materials. A round-nosed diamond tool was swung by rotating the B-axis rotary table of the machine, the center of which was aligned with the tool center. The tool-decentering error was detected and compensated for by an on-machine measurement system. The effects of tool-swinging direction, swinging speed, lubricant type, and tool rake angle were investigated. The tool wear was greatly reduced compared to the conventional method. A surface finish of 4 nm Ra was obtained on reaction-bonded silicon carbide by generating continuous chips.

Original language	English
Pages (from-to)	109-112
Number of pages	4
Journal	CIRP Annals - Manufacturing Technology
Volume	59
Issue number	1
DOIs	https://doi.org/10.1016/j.cirp.2010.03.067
Publication status	Published - 2010

Keywords

Ceramic mold
Cutting
Ultraprecision

ASJC Scopus subject areas

Mechanical Engineering
Industrial and Manufacturing Engineering

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AB - A tool-swinging method was proposed to reduce tool wear in diamond turning of high-strength mold materials. A round-nosed diamond tool was swung by rotating the B-axis rotary table of the machine, the center of which was aligned with the tool center. The tool-decentering error was detected and compensated for by an on-machine measurement system. The effects of tool-swinging direction, swinging speed, lubricant type, and tool rake angle were investigated. The tool wear was greatly reduced compared to the conventional method. A surface finish of 4 nm Ra was obtained on reaction-bonded silicon carbide by generating continuous chips.

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KW - Cutting

KW - Ultraprecision

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