Ti3SiC2-(Ti3SiC2-SiC) functionally graded materials by spark plasma sintering reactive synthesis method Part 1 - Gradient optimizations

W. Jiang; J. F. Zhang; L. J. Wang; R. Tu; X. Q. Yang; G. Chen; P. C. Zhai

doi:10.1179/175355509X12608871788031

Ti₃SiC₂-(Ti₃SiC₂-SiC) functionally graded materials by spark plasma sintering reactive synthesis method Part 1 - Gradient optimizations

W. Jiang, J. F. Zhang, L. J. Wang, R. Tu, X. Q. Yang, G. Chen, P. C. Zhai

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

The graded structure of functionally graded materials can greatly reduce the residual thermal stress compared with non-graded interface of directly jointed materials. Finite element analysis was conducted to study the residual thermal stress induced on cooling from the sintering temperature of Ti ₃SiC₂-(Ti₃SiC₂-SiC) FMGs. For a circular disk shaped specimen with a fixed geometric size of Ti ₃SiC₂-(Ti₃SiC₂-SiC) FMGs, optimum grade layer number N as well as composition distribution exponent p for minimising residual stress is identified. The simulation results indicated that the optimum layer number N and composition distribution exponent p can not only reduce the stress level, but also make the stress distribute more uniformly.

Original language	English
Pages (from-to)	276-282
Number of pages	7
Journal	Materials Technology
Volume	25
Issue number	5
DOIs	https://doi.org/10.1179/175355509X12608871788031
Publication status	Published - 2010 Nov 1

Keywords

Finite element analysis
Functionally graded materials
Residual thermal stress

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.1179/175355509X12608871788031

Cite this

@article{057748c0f18844b6926668a17fcc6cdb,

title = "Ti3SiC2-(Ti3SiC2-SiC) functionally graded materials by spark plasma sintering reactive synthesis method Part 1 - Gradient optimizations",

abstract = "The graded structure of functionally graded materials can greatly reduce the residual thermal stress compared with non-graded interface of directly jointed materials. Finite element analysis was conducted to study the residual thermal stress induced on cooling from the sintering temperature of Ti 3SiC2-(Ti3SiC2-SiC) FMGs. For a circular disk shaped specimen with a fixed geometric size of Ti 3SiC2-(Ti3SiC2-SiC) FMGs, optimum grade layer number N as well as composition distribution exponent p for minimising residual stress is identified. The simulation results indicated that the optimum layer number N and composition distribution exponent p can not only reduce the stress level, but also make the stress distribute more uniformly.",

keywords = "Finite element analysis, Functionally graded materials, Residual thermal stress",

author = "W. Jiang and Zhang, {J. F.} and Wang, {L. J.} and R. Tu and Yang, {X. Q.} and G. Chen and Zhai, {P. C.}",

year = "2010",

month = nov,

day = "1",

doi = "10.1179/175355509X12608871788031",

language = "English",

volume = "25",

pages = "276--282",

journal = "Materials Technology",

issn = "1066-7857",

publisher = "Maney Publishing",

number = "5",

}

TY - JOUR

T1 - Ti3SiC2-(Ti3SiC2-SiC) functionally graded materials by spark plasma sintering reactive synthesis method Part 1 - Gradient optimizations

AU - Jiang, W.

AU - Zhang, J. F.

AU - Wang, L. J.

AU - Tu, R.

AU - Yang, X. Q.

AU - Chen, G.

AU - Zhai, P. C.

PY - 2010/11/1

Y1 - 2010/11/1

N2 - The graded structure of functionally graded materials can greatly reduce the residual thermal stress compared with non-graded interface of directly jointed materials. Finite element analysis was conducted to study the residual thermal stress induced on cooling from the sintering temperature of Ti 3SiC2-(Ti3SiC2-SiC) FMGs. For a circular disk shaped specimen with a fixed geometric size of Ti 3SiC2-(Ti3SiC2-SiC) FMGs, optimum grade layer number N as well as composition distribution exponent p for minimising residual stress is identified. The simulation results indicated that the optimum layer number N and composition distribution exponent p can not only reduce the stress level, but also make the stress distribute more uniformly.

AB - The graded structure of functionally graded materials can greatly reduce the residual thermal stress compared with non-graded interface of directly jointed materials. Finite element analysis was conducted to study the residual thermal stress induced on cooling from the sintering temperature of Ti 3SiC2-(Ti3SiC2-SiC) FMGs. For a circular disk shaped specimen with a fixed geometric size of Ti 3SiC2-(Ti3SiC2-SiC) FMGs, optimum grade layer number N as well as composition distribution exponent p for minimising residual stress is identified. The simulation results indicated that the optimum layer number N and composition distribution exponent p can not only reduce the stress level, but also make the stress distribute more uniformly.

KW - Finite element analysis

KW - Functionally graded materials

KW - Residual thermal stress

UR - http://www.scopus.com/inward/record.url?scp=78650112543&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78650112543&partnerID=8YFLogxK

U2 - 10.1179/175355509X12608871788031

DO - 10.1179/175355509X12608871788031

M3 - Article

AN - SCOPUS:78650112543

VL - 25

SP - 276

EP - 282

JO - Materials Technology

JF - Materials Technology

SN - 1066-7857

IS - 5

ER -