Abstract
The graded structure of functionally graded materials can greatly reduce the residual thermal stress compared with non-graded interface of directly jointed materials. Finite element analysis was conducted to study the residual thermal stress induced on cooling from the sintering temperature of Ti 3SiC2-(Ti3SiC2-SiC) FMGs. For a circular disk shaped specimen with a fixed geometric size of Ti 3SiC2-(Ti3SiC2-SiC) FMGs, optimum grade layer number N as well as composition distribution exponent p for minimising residual stress is identified. The simulation results indicated that the optimum layer number N and composition distribution exponent p can not only reduce the stress level, but also make the stress distribute more uniformly.
Original language | English |
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Pages (from-to) | 276-282 |
Number of pages | 7 |
Journal | Materials Technology |
Volume | 25 |
Issue number | 5 |
DOIs | |
Publication status | Published - 2010 Nov 1 |
Externally published | Yes |
Keywords
- Finite element analysis
- Functionally graded materials
- Residual thermal stress
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering