Ti3SiC2-(Ti3SiC2-SiC) functionally graded materials by spark plasma sintering reactive synthesis method Part 1 - Gradient optimizations

W. Jiang; J. F. Zhang; L. J. Wang; R. Tu; X. Q. Yang; G. Chen; P. C. Zhai

doi:10.1179/175355509X12608871788031

Ti₃SiC₂-(Ti₃SiC₂-SiC) functionally graded materials by spark plasma sintering reactive synthesis method Part 1 - Gradient optimizations

W. Jiang, J. F. Zhang, L. J. Wang, R. Tu, X. Q. Yang, G. Chen, P. C. Zhai

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

The graded structure of functionally graded materials can greatly reduce the residual thermal stress compared with non-graded interface of directly jointed materials. Finite element analysis was conducted to study the residual thermal stress induced on cooling from the sintering temperature of Ti ₃SiC₂-(Ti₃SiC₂-SiC) FMGs. For a circular disk shaped specimen with a fixed geometric size of Ti ₃SiC₂-(Ti₃SiC₂-SiC) FMGs, optimum grade layer number N as well as composition distribution exponent p for minimising residual stress is identified. The simulation results indicated that the optimum layer number N and composition distribution exponent p can not only reduce the stress level, but also make the stress distribute more uniformly.

Original language	English
Pages (from-to)	276-282
Number of pages	7
Journal	Materials Technology
Volume	25
Issue number	5
DOIs	https://doi.org/10.1179/175355509X12608871788031
Publication status	Published - 2010 Nov 1
Externally published	Yes

Keywords

Finite element analysis
Functionally graded materials
Residual thermal stress

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.1179/175355509X12608871788031

Cite this

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title = "Ti3SiC2-(Ti3SiC2-SiC) functionally graded materials by spark plasma sintering reactive synthesis method Part 1 - Gradient optimizations",

abstract = "The graded structure of functionally graded materials can greatly reduce the residual thermal stress compared with non-graded interface of directly jointed materials. Finite element analysis was conducted to study the residual thermal stress induced on cooling from the sintering temperature of Ti 3SiC2-(Ti3SiC2-SiC) FMGs. For a circular disk shaped specimen with a fixed geometric size of Ti 3SiC2-(Ti3SiC2-SiC) FMGs, optimum grade layer number N as well as composition distribution exponent p for minimising residual stress is identified. The simulation results indicated that the optimum layer number N and composition distribution exponent p can not only reduce the stress level, but also make the stress distribute more uniformly.",

keywords = "Finite element analysis, Functionally graded materials, Residual thermal stress",

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T1 - Ti3SiC2-(Ti3SiC2-SiC) functionally graded materials by spark plasma sintering reactive synthesis method Part 1 - Gradient optimizations

AU - Jiang, W.

AU - Zhang, J. F.

AU - Wang, L. J.

AU - Tu, R.

AU - Yang, X. Q.

AU - Chen, G.

AU - Zhai, P. C.

PY - 2010/11/1

Y1 - 2010/11/1

N2 - The graded structure of functionally graded materials can greatly reduce the residual thermal stress compared with non-graded interface of directly jointed materials. Finite element analysis was conducted to study the residual thermal stress induced on cooling from the sintering temperature of Ti 3SiC2-(Ti3SiC2-SiC) FMGs. For a circular disk shaped specimen with a fixed geometric size of Ti 3SiC2-(Ti3SiC2-SiC) FMGs, optimum grade layer number N as well as composition distribution exponent p for minimising residual stress is identified. The simulation results indicated that the optimum layer number N and composition distribution exponent p can not only reduce the stress level, but also make the stress distribute more uniformly.

AB - The graded structure of functionally graded materials can greatly reduce the residual thermal stress compared with non-graded interface of directly jointed materials. Finite element analysis was conducted to study the residual thermal stress induced on cooling from the sintering temperature of Ti 3SiC2-(Ti3SiC2-SiC) FMGs. For a circular disk shaped specimen with a fixed geometric size of Ti 3SiC2-(Ti3SiC2-SiC) FMGs, optimum grade layer number N as well as composition distribution exponent p for minimising residual stress is identified. The simulation results indicated that the optimum layer number N and composition distribution exponent p can not only reduce the stress level, but also make the stress distribute more uniformly.

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KW - Functionally graded materials

KW - Residual thermal stress

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