Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration

Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jichoru Be, Kanuku Ri, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A 12-channel vertical cavity surface emitting laser (VCSEL) chip was heterogeneously self-assembled to a glass interposer wafer by liquid surface tension as a driving force. The size of the VCSEL chip was 0.35 mm wide and 3 mm long. From the square dummy chips having structurally similar periphery to the VCSEL, the step structure at the chip edge was found to be significantly dependent on the alignment accuracies. From the rectangular dummy chips having the same sizes to the long VCSEL, the tiny chips were precisely self-assembled with alignment accuracies within 2 μm even when they were manually placed on water droplets provided on host Si wafers. After selfassembly of the VCSEL chip and the subsequent thermal compression, the VCSEL was accurately positioned, successfully emitted 850-nm light, and exhibited no degradation of the I-V characteristics. This paper also presents our recent progress on the hybrid integration of chip-scale photonic devices with 3D/TSV technologies for optical interconnections.

Original languageEnglish
Title of host publication2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479984725
DOIs
Publication statusPublished - 2014 Jan 1
EventInternational 3D Systems Integration Conference, 3DIC 2014 - Kinsdale, Ireland
Duration: 2014 Dec 12014 Dec 3

Publication series

Name2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings

Other

OtherInternational 3D Systems Integration Conference, 3DIC 2014
CountryIreland
CityKinsdale
Period14/12/114/12/3

Keywords

  • 3D integration
  • And microubmp bonding
  • Heterogeneous integration
  • Hybrid integration
  • Self-assembly
  • VCSEL

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Hardware and Architecture

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    Fukushima, T., Ito, Y., Murugesan, M., Be, J., Ri, K., Choki, K., Tanaka, T., & Koyanagi, M. (2014). Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration. In 2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings [07152145] (2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/3DIC.2014.7152145