Time-dependent dielectric breakdown of SiO2 films in a wide electric field range

A. Teramoto, H. Umeda, K. Azamawari, K. Kobayashi, K. Shiga, J. Komori, Y. Ohno, A. Shigetomi

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

We have performed time dependent dielectric breakdown measurement of SiO2 films in the electric field (EOX) range 7-13.5 MV/cm and evaluated the electric field dependence of intrinsic lifetime, using both area and temperature dependences of oxide lifetime. We have evaluated the electric field dependence of time to breakdown (tBD) below 125 °C, because the activation energy of intrinsic lifetime changes at 125 °C tBD of 7.1 and 9.6 nm oxides is not proportional to exp(EOX) but proportional to exp(1/EOX). This suggests that the breakdown mechanism of 9.6 and 7.1 nm oxides is the same and adheres to the anode hole injection model. However, the breakdown mechanism of 4.0 nm oxides is not the same as that of 7.1 and 9.6 nm oxides. The slope of log(tBD) versus 1/EOX plot in 4.0 nm oxide increases with decreasing oxide fields. The intrinsic lifetime in the positive gate bias decreases with increasing oxide thicknesses in the range of electric fields employed in the present experiment.

Original languageEnglish
Pages (from-to)47-52
Number of pages6
JournalMicroelectronics Reliability
Volume41
Issue number1
DOIs
Publication statusPublished - 2001 Jan
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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