Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI

Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

To realize very high performance computing system, we have proposed a novel opto-electronic 3-D LSI in which both electrical and optical devices are integrated. For realizing such opto-electronic 3-D LSI, through Si photonic via (TSPV) is indispensable for vertical light transmission. In this work, we fabricated the TSPV comprising Si core and epoxy cladding. We measured near field patterns (NFP) of laser light passed through the TSPV to evaluate its light confinement effect. From the results of NFP measurement, we confirmed that the laser light was successfully confined and propagated in the Si core region of the TSPV. We successfully developed a fabrication process to form both the TSPV and TSV simultaneously. The size of the fabricated TSPV and TSV was 20μmx20μm and 16μmx16μm, respectively.

Original languageEnglish
Title of host publicationIEEE 3D System Integration Conference 2010, 3DIC 2010
DOIs
Publication statusPublished - 2010 Dec 1
Event2nd IEEE International 3D System Integration Conference, 3DIC 2010 - Munich, Germany
Duration: 2010 Nov 162010 Nov 18

Publication series

NameIEEE 3D System Integration Conference 2010, 3DIC 2010

Other

Other2nd IEEE International 3D System Integration Conference, 3DIC 2010
Country/TerritoryGermany
CityMunich
Period10/11/1610/11/18

ASJC Scopus subject areas

  • Control and Systems Engineering

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