TY - GEN
T1 - Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI
AU - Noriki, Akihiro
AU - Lee, Kang Wook
AU - Bea, Jichoel
AU - Fukushima, Takafumi
AU - Tanaka, Tetsu
AU - Koyanagi, Mitsumasa
PY - 2010/12/1
Y1 - 2010/12/1
N2 - To realize very high performance computing system, we have proposed a novel opto-electronic 3-D LSI in which both electrical and optical devices are integrated. For realizing such opto-electronic 3-D LSI, through Si photonic via (TSPV) is indispensable for vertical light transmission. In this work, we fabricated the TSPV comprising Si core and epoxy cladding. We measured near field patterns (NFP) of laser light passed through the TSPV to evaluate its light confinement effect. From the results of NFP measurement, we confirmed that the laser light was successfully confined and propagated in the Si core region of the TSPV. We successfully developed a fabrication process to form both the TSPV and TSV simultaneously. The size of the fabricated TSPV and TSV was 20μmx20μm and 16μmx16μm, respectively.
AB - To realize very high performance computing system, we have proposed a novel opto-electronic 3-D LSI in which both electrical and optical devices are integrated. For realizing such opto-electronic 3-D LSI, through Si photonic via (TSPV) is indispensable for vertical light transmission. In this work, we fabricated the TSPV comprising Si core and epoxy cladding. We measured near field patterns (NFP) of laser light passed through the TSPV to evaluate its light confinement effect. From the results of NFP measurement, we confirmed that the laser light was successfully confined and propagated in the Si core region of the TSPV. We successfully developed a fabrication process to form both the TSPV and TSV simultaneously. The size of the fabricated TSPV and TSV was 20μmx20μm and 16μmx16μm, respectively.
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U2 - 10.1109/3DIC.2010.5751435
DO - 10.1109/3DIC.2010.5751435
M3 - Conference contribution
AN - SCOPUS:79955957246
SN - 9781457705274
T3 - IEEE 3D System Integration Conference 2010, 3DIC 2010
BT - IEEE 3D System Integration Conference 2010, 3DIC 2010
T2 - 2nd IEEE International 3D System Integration Conference, 3DIC 2010
Y2 - 16 November 2010 through 18 November 2010
ER -