Through-silicon photonic via and unidirectional coupler for high-speed data transmission in optoelectronic three-dimensional LSI

Akihiro Noriki, Kangwook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)

Abstract

We develop Si-core through-silicon photonic via (TSPV) and unidirectional coupler for low-loss and high-speed data transmission in an optoelectronic 3-D LSI. The TSPVs, comprising a Si-core and SiO 2 cladding, were fabricated simultaneously with Cu TSVs. The characteristics of light confinement of the TSPV were measured using a near-field pattern measurement. The spot light area was well confined within the TSPV without interference from the lights. The optical intensity that passed through the TSPV was 20% higher than that which passed through the Si substrate. The unidirectional optical coupler with two mirrors showed higher coupling efficiency. Laser light can be efficiently propagated to a planar Si waveguide through the TSPV and the unidirectional coupler.

Original languageEnglish
Article number6101553
Pages (from-to)221-223
Number of pages3
JournalIEEE Electron Device Letters
Volume33
Issue number2
DOIs
Publication statusPublished - 2012 Feb

Keywords

  • Coupling efficiency
  • near-field pattern (NFP)
  • optical coupler
  • optoelectronic 3-D LSI
  • through-silicon photonic via (TSPV)

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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