Threshold-voltage reduction of FinFETs by Ta/Mo interdiffusion dual metal-gate technology for low-operating-power application

Takashi Matsukawa, Kazuhiko Endo, Yongxun Liu, Shinichi O'uchi, Yuki Ishikawa, Hiromi Yamauchi, Junichi Tsukada, Kenichi Ishii, Meishoku Masahara, Kunihiro Sakamoto, Eiichi Suzuki

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

In this paper, Ta/Mo interdiffusion dual metal-gate technology, which has an advantage in realizing dual gate work functions without etching of metals from the gate dielectrics, has been introduced for a FinFET. Gate-first fabrication of the FinFET was successfully implemented by optimizing the deposition and patterning of the Mo and Ta/Mo metal gates on the ultrathin fin channels. The Ta/Mo-gated n-MOS and Mo-gated p-MOS FinFET exhibit symmetrical values of Vth (0.31/-0.36 V), which are desirable for FinFET CMOS circuit operation with enhanced current drivability, because the threshold voltage (Vth) is reduced due to Ta diffusion in the Ta/Mo gate. It was experimentally found that the Ta/Mo interdiffusion process causes no degradation in integrity of the gate dielectric or the carrier mobility. It was also confirmed that the Ta/Mo interdiffusion process is appropriate for a scaled gate length down to 100 nm.

Original languageEnglish
Pages (from-to)2454-2461
Number of pages8
JournalIEEE Transactions on Electron Devices
Volume55
Issue number9
DOIs
Publication statusPublished - 2008
Externally publishedYes

Keywords

  • CMOSFET
  • Dual metal gate
  • FinFET
  • Interdiffusion
  • Molybdenum (Mo)
  • Tantalum (Ta)
  • Work function (WF)

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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