Three‐dimensional memory LSI with optical interconnections

Mitsumasa Koyanagi, Hirokazu Takata, Hiroshi Okano, Shin Yokoyama

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

As devices are miniaturized and device operation speed increases by the progress of fine fabrication technology, the problems associated with interconnections such as interconnect delay and crosstalk are becoming important. Therefore, an optical connection as a new interconnect technique to solve these interconnection related problems is becoming noticed. On the other hand, three‐dimensional LSIs are again becoming noticed as an LSI to overcome the limitations of high integration and to incorporate new functions such as parallel processing function. Consequently, this paper examines the possibility of LSI with new function surpassing the present LSIs by combining the optical interconnection and three‐dimensional LSIs by combining the optical interconnection and three‐dimensional LSI. As an example of this kind of LSI, a three‐dimensional optically coupled common memory is described and the performance improvements are specifically shown by combining the optical interconnection and three‐dimensional LSI.

Original languageEnglish
Pages (from-to)1-13
Number of pages13
JournalElectronics and Communications in Japan (Part II: Electronics)
Volume76
Issue number2
DOIs
Publication statusPublished - 1993

Keywords

  • 3‐D memory LSI
  • Optical interconnection
  • common memory
  • parallel processing
  • wafer bonding

ASJC Scopus subject areas

  • Physics and Astronomy(all)
  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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