Three-dimensional super-chip integration technology using self-assembly technique

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationIEEE 2008 Silicon Nanoelectronics Workshop, SNW 2008
DOIs
Publication statusPublished - 2008 Dec 1
EventIEEE 2008 Silicon Nanoelectronics Workshop, SNW 2008 - Honolulu, HI, United States
Duration: 2008 Jun 152008 Jun 16

Other

OtherIEEE 2008 Silicon Nanoelectronics Workshop, SNW 2008
CountryUnited States
CityHonolulu, HI
Period08/6/1508/6/16

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this