Three-dimensional microcoil oscillator fabricated with monolithic process on LSI

Tomotaka Yabe, Yasuhiro Mimura, Hirokazu Takahashi, Atsushi Onoe, Sho Muroga, Masahiro Yamaguchi, Takahito Ono, Masayoshi Esashi

Research output: Contribution to journalArticle

Abstract

Integration of three-dimensional microcoils on high-performance RF-LSI is one of the key technologies to realize future wireless telecommunication services and hypersensitive capacitance sensor systems. We designed and fabricated monolithic three-dimensional microcoils on an LSI substrate. The microcoil has long legs, which will minimize electromagnetic coupling to the LSI substrate. We succeeded in confirming the basic operation of the integrated oscillator circuit in the gigahertz frequency range. It was confirmed that process damage due to plasma ashing, heating at 200 °C, and sputter etching were not observed in the oscillation performance.

Original languageEnglish
Pages (from-to)49-56
Number of pages8
JournalElectronics and Communications in Japan
Volume95
Issue number11
DOIs
Publication statusPublished - 2012 Nov 1

Keywords

  • MEMS microcoil
  • monolithic technique

ASJC Scopus subject areas

  • Signal Processing
  • Physics and Astronomy(all)
  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Applied Mathematics

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