Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Fingerprint Dive into the research topics of 'Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding'. Together they form a unique fingerprint.

Engineering & Materials Science