Three-dimensional integration technology for sensor application using 5-μm-pitch au cone bump connections

Makoto Motoyoshi, Kohki Yanagimura, Junichi Takanohashi, Mariappan Murugesan, Masahiro Aoyagi, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper presents the experimental results of a pixel detector device fabricated with 3-μmφ gold cone bump connections using adhesive injections. The as-deposited cone bump consists of gold nanoparticles and is easier to deform than plating gold. Consequently, the collapsibility of the gold cone bump allows for low-stress bonding, resulting in a compliant and reliable junction. The size of the bump is determined by photoresist patterning, and its connections do not protrude significantly during junction formation, in contrast with melting-type bump connections. In addition, the shrink ratio of the volume is larger than that of the surface area. The bump resistance of an easily oxidized metal with a diameter of a few microns is affected by the bonding atmosphere. In contrast, bonding with a micro gold cone bump does not adversely affect the electrical characteristics because gold is an oxidation-resistant material. The resistance per bump is approximately 6 ω with a robust junction formed. The influence of the stress caused by the bump junction on the MOS characteristics is also investigated.

Original languageEnglish
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1365-1370
Number of pages6
ISBN (Electronic)9781479986095
DOIs
Publication statusPublished - 2015 Jul 15
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: 2015 May 262015 May 29

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2015-July
ISSN (Print)0569-5503

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
CountryUnited States
CitySan Diego
Period15/5/2615/5/29

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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