Three-dimensional integration technology for real time micro-vision system

H. Kurino, T. Matsumoto, K. H. Yu, N. Miyakawa, H. Itani, H. Tsukamoto, M. Koyanagi

Research output: Contribution to journalConference article

21 Citations (Scopus)

Abstract

It becomes possible to achieve the real time micro-vision system with extremely high image processing speed if three-dimensional LSI comes into reality because a higher level of parallel processing can be performed in three-dimensional LSI. Then, we have proposed a new three-dimensional integration technology for such real time micro-vision system with high image processing speed. Several key technologies for three-dimensional integration such as formation of buried interconnection and micro-bump, wafer thinning, wafer alignment and wafer bonding have been developed.

Original languageEnglish
Pages (from-to)203-212
Number of pages10
JournalProceedings of the Annual IEEE International Conference on Innovative Systems in Silicon
Publication statusPublished - 1997 Dec 1
EventProceedings of the 1997 2nd Annual IEEE International Conference on Innovative Systems in Silicon - Austin, TX, USA
Duration: 1997 Oct 81997 Oct 10

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Condensed Matter Physics

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