Three-dimensional hybrid integration technology of CMOS, MEMS, and photonics circuits for optoelectronic heterogeneous integrated systems

Kang Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Contribution to journalArticlepeer-review

78 Citations (Scopus)

Abstract

We have developed a new 3-D hybrid integration technology of complementary metaloxidesemiconductors, microelectromechanical systems (MEMS), and photonics circuits for optoelectronic heterogeneous integrated systems. We have overcome the fabrication difficulties of optoelectromechanical and microfluidics hybrid integration. In order to verify the applied 3-D hybrid integration technology, we fabricated a 3-D optoelectronic multichip module composed of large-scale integration (LSI), MEMS, and photonics devices. The electrical chips of amplitude-shift keying (ASK) LSI, passive, and pressure-sensing MEMS were mounted onto an electrical Si interposer with through-silicon vias (TSVs) and microfluidic channels. Photonics chips of vertical-cavity surface-emitting lasers and photodiodes were embedded into an optical Si interposer with TSVs. The electrical and optical interposers were precisely bonded together to form a 3-D optoelectronic multichip module. The photonics and electrical devices could communicate via TSVs. The photonics devices could be connected via an optical waveguide formed onto the optical interposer. Microfluidic channels were formed into the interposer by a wafer-direct bonding technique for heat sinking from high-power LSIs. In this paper, we evaluated the basic functions of individual chips of LSI, MEMS, and photonics devices as they were integrated into the 3-D optoelectronic multichip module to verify the applied 3-D hybrid integration technology. LSI, passive, MEMS, and photonics devices were successfully implemented. The 3-D hybrid integration technology is capable of providing a powerful solution for realizing optoelectronic heterogeneous integrated systems.

Original languageEnglish
Article number5677480
Pages (from-to)748-757
Number of pages10
JournalIEEE Transactions on Electron Devices
Volume58
Issue number3
DOIs
Publication statusPublished - 2011 Mar

Keywords

  • 3-D hybrid integration
  • Chip self-assembly
  • Si interposer
  • microfluidic channel
  • optoelectronic heterogeneous integrated system
  • through-silicon via (TSV)
  • waveguide

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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