TY - CONF
T1 - Thin beam bulk micromachining based on RIE and xenon difluoride silicon etching
AU - Toda, Risaku
AU - Minami, Kazuyuki
AU - Esashi, Masayoshi
N1 - Funding Information:
A part of this work was performed at the Venture Business Laboratory of Tohoku University. The authors would like to thank Professor K.S.J. Pister of the University of California, Los Angeles (presently at UC Berkeley) for helpful discussions. The authors also wi-sh to thank Sumitomo Precision Products Co. Ltd. for the STS ASE processing. This work was partly supported by the Japanese Ministry of Education Science, Sports and Culture under grant-in-aid No. 07555125. The authors also acknowledge the Electro-mechanic Technology Advancing Foundation for partial support of this research.
Copyright:
Copyright 2004 Elsevier Science B.V., Amsterdam. All rights reserved.
PY - 1997
Y1 - 1997
N2 - A new process for fabricating thin mechanical beam structures from single crystal silicon is developed. Lateral and vertical dimensions of the beam can be precisely defined. The beam is positioned in the middle of a silicon wafer at exactly equal distances from both sides. The beam design is not limited by crystal orientations of silicon. The silicon beam structure is essentially stress-free because the whole structure is made of uniformly doped single crystal silicon. This thin beam process offers significantly expanded design freedom to bulk silicon micromachining. Additionally, very high aspect ratio silicon dioxide structure is fabricated with a similar technique.
AB - A new process for fabricating thin mechanical beam structures from single crystal silicon is developed. Lateral and vertical dimensions of the beam can be precisely defined. The beam is positioned in the middle of a silicon wafer at exactly equal distances from both sides. The beam design is not limited by crystal orientations of silicon. The silicon beam structure is essentially stress-free because the whole structure is made of uniformly doped single crystal silicon. This thin beam process offers significantly expanded design freedom to bulk silicon micromachining. Additionally, very high aspect ratio silicon dioxide structure is fabricated with a similar technique.
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M3 - Paper
AN - SCOPUS:0030674571
SP - 671
EP - 674
T2 - Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators. Part 1 (of 2)
Y2 - 16 June 1997 through 19 June 1997
ER -