Thermoelectric Properties of Microstructurally Modified CoSb3 Skutterudite by Hf-Addition

Mohamed Hamid Elsheikh, Mohd Faizul Mohd Sabri, Suhana Mohd Said, Yuzuru Miyazaki, H. H. Masjuki, Dhafer Abdul Ameer Shnawah, Bui Duc Long, Shuma Naito, Mohamed Bashir Ali Bashir

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A polycrystalline phase of Hf-filled CoSb3 skutterudite was successfully prepared by the mechanical alloying technique followed by the spark plasma sintering process. X-ray diffraction and scanning electron microscopy linked with energy-dispersive x-ray spectroscopy were used to investigate the result filling the void spaces with Hf. HfCo4Sb12 skutterudite possesses a very low thermal conductivity [1.8 W/(m K)], lower than that of some lanthanide-filled skutterudites, while exhibiting p-type conduction. The anharmonicity of oscillation of the loosely bond Hf atoms, the point defects on the lattice microstructure and the large area fraction of the grain boundaries were the reasons for the significant drop in the thermal conductivity of Hf-filled CoSb3. Thus, this work is useful in deriving a pathway for improvement in thermoelectrics through the introduction of smaller rattling cations with higher mass to increase the disorder of the lattice structure.

Original languageEnglish
Pages (from-to)2886-2890
Number of pages5
JournalJournal of Electronic Materials
Volume45
Issue number6
DOIs
Publication statusPublished - 2016 Jun 1

Keywords

  • Ball mill
  • SPS
  • filled-skutterudite
  • microstructure
  • thermoelectric

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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  • Cite this

    Elsheikh, M. H., Sabri, M. F. M., Said, S. M., Miyazaki, Y., Masjuki, H. H., Shnawah, D. A. A., Long, B. D., Naito, S., & Bashir, M. B. A. (2016). Thermoelectric Properties of Microstructurally Modified CoSb3 Skutterudite by Hf-Addition. Journal of Electronic Materials, 45(6), 2886-2890. https://doi.org/10.1007/s11664-016-4355-2