Thermodynamic database on microsolders and copper-based alloy systems

X. J. Liu, I. Ohnuma, C. P. Wang, M. Jiang, R. Kainuma, K. Ishida, M. Ode, T. Koyama, H. Onodera, T. Suzuki

Research output: Contribution to journalArticlepeer-review

40 Citations (Scopus)

Abstract

Recent progress on the thermodynamic databases of calculated phase diagrams in microsolders and Cu-based alloys is presented. A thermodynamic tool, Alloy Database for Microsolders (ADAMIS), is based on comprehensive experimental and thermodynamic data accumulated with the calculation of phase diagrams (CALPHAD) method and contains eight elements, namely, Ag, Bi, Cu, In, Sb, Sn, Zn, and Pb. It can handle all combinations of these elements and all composition ranges. The elements of Al and Au have also been added to ADAMIS within a limited range of compositions. Furthermore, a database of Cu-based alloys, including binary (Cu-X), ternary (Cu-Fe-X, Cu-Ni-X, and Cu-Cr-X), and multicomponent (Cu-Ni-Cr-Sn-Zn-Fe-Si) systems, has also been developed. Typical examples of the calculation and application of these databases are presented. These databases are expected to be a powerful tool for the development of Pb-free solders and Cu substrate materials as well as for promoting the understanding of the interfacial phenomena between them in electronic packaging technology.

Original languageEnglish
Pages (from-to)1265-1272
Number of pages8
JournalJournal of Electronic Materials
Volume32
Issue number11
DOIs
Publication statusPublished - 2003 Nov
Externally publishedYes

Keywords

  • Calculation of phase diagram
  • Cu-based alloys
  • Interfacial reaction
  • Pb-free solders
  • Phase-field method
  • Thermodynamic database

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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