TY - JOUR
T1 - Thermodynamic calculation of phase equilibria in the Sn-Ag-Cu-Ni-Au system
AU - Liu, X. J.
AU - Wang, C. P.
AU - Gao, F.
AU - Ohnuma, I.
AU - Ishida, K.
N1 - Funding Information:
This work was jointly supported by the National Natural Science Foundation of China (grant no. 50425101), The Ministry of Science and Technology of China (grant no. 2004CCA0420), The Ministry of Education of China (grant nos. 20050384003 and 105100), and Fujian Provincial Department of Science & Technology (grant no. 2005HZ1015). Support from a Core Research for Evolutional Science and Technology (CREST), Japan Science and Technology Agency (JST), and the Xiamen Bureau of Science & Technology (grant no. 02Z20055016) is also acknowledged.
PY - 2007/11
Y1 - 2007/11
N2 - Sn-Ag-Cu base solders are the most promising candidates to substitute for Sn-Pb eutectic solder. Gold (Au) coatings are used to protect conductor surfaces from oxidation and thereby to promote solderability, and Ni is often used as a diffusion barrier layer between lead-free solders and substrates to restrict the growth of intermetallic compound layers. In the present work, thermodynamic calculations of phase equilibria in the Sn-Ag-Cu-Ni-Au system, which is of importance for developing lead-free solders, are carried out using the calculation of phase diagrams (CALPHAD) method. Substitutional solution and sublattice models are used to describe the solution and intermediate phases, respectively. Some examples of thermodynamic calculation are presented, and it is shown that the phase diagrams, liquidus projection, and thermodynamic properties can be predicted based on the present calculations.
AB - Sn-Ag-Cu base solders are the most promising candidates to substitute for Sn-Pb eutectic solder. Gold (Au) coatings are used to protect conductor surfaces from oxidation and thereby to promote solderability, and Ni is often used as a diffusion barrier layer between lead-free solders and substrates to restrict the growth of intermetallic compound layers. In the present work, thermodynamic calculations of phase equilibria in the Sn-Ag-Cu-Ni-Au system, which is of importance for developing lead-free solders, are carried out using the calculation of phase diagrams (CALPHAD) method. Substitutional solution and sublattice models are used to describe the solution and intermediate phases, respectively. Some examples of thermodynamic calculation are presented, and it is shown that the phase diagrams, liquidus projection, and thermodynamic properties can be predicted based on the present calculations.
KW - CALPHAD
KW - Pb-free solder
KW - Sn-Ag-Cu-Ni-Au system
KW - Thermodynamic model
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U2 - 10.1007/s11664-007-0247-9
DO - 10.1007/s11664-007-0247-9
M3 - Article
AN - SCOPUS:35248890418
VL - 36
SP - 1429
EP - 1441
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
SN - 0361-5235
IS - 11
ER -