Thermally stable CGC perpendicular recording media with Pt-rich CoPtCr and thin Pt layers

Y. Sonobe, H. Muraoka, K. Miura, Y. Nakamura, K. Takano, A. Moser, H. Do, B. K. Yen, Y. Ikeda, N. Supper, W. Weresin

Research output: Contribution to journalConference articlepeer-review

38 Citations (Scopus)


Thermal stability of coupled granular/continuous (CGC) perpendicular media is supported by fundamental modeling and experimental results, including spin-stand testing. By incorporating the interlayer exchange coupling into the model, the simulation result suggests that the CGC structure is capable of achieving the energy barrier of KuV/kB T required for 1 Tbit/in2 recording density. To demonstrate the CGC approach, we investigate a new class of CGC perpendicular media consisting of a Pt-rich CoPtCr layer with poor Co-Cr phase segregation and a thin Pt layer. The addition of these layers improves the nucleation field of the CoCr18Pt12 medium from +420 to -600 Oe and the thermal decay of the output is reduced from 2.23% to 0.10% per decade. Unity squareness was obtained by using a thin Pt capping layer and resulted in a small decay rate of 0.21% per decade. The new CGC media showed no degradation of SNR compared to the base granular medium. Similar to CGC media utilizing a multilayer capping structure, the CGC medium with a Pt-rich CoPtCr or Pt capping structure improved the thermal stability without compromising SNR. The simplicity of these new CGC structures also greatly simplifies the deposition process.

Original languageEnglish
Pages (from-to)2006-2011
Number of pages6
JournalIEEE Transactions on Magnetics
Issue number5 I
Publication statusPublished - 2002 Sep
Externally publishedYes
Event2002 International Magnetics Conference (Intermag 2002) - Amsterdam, Netherlands
Duration: 2002 Apr 282002 May 2


  • Continuous layer
  • Granular layer
  • Perpendicular media
  • Pt layer
  • Signal-to-noise ratio
  • Thermal stability

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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