Thermal transients during processing of materials by very high power ultrasonic additive manufacturing

M. R. Sriraman, Matt Gonser, Hiromichi T. Fujii, S. S. Babu, Matt Bloss

Research output: Contribution to journalArticlepeer-review

56 Citations (Scopus)

Abstract

Dynamic recrystallisation at interfaces has been suggested as the bonding mechanism in the joining of metallic tapes, during very high power ultrasonic additive manufacturing. To understand the reasons for such occurrence of dynamic recrystallization, thermal transients from the interface regions were recorded during processing of aluminum alloy (3003 and 6061 series) and 11 000 copper tapes under similar conditions. Measurements in 3003 Al were also carried out for different processing parameters. Measured peak temperatures were seen to increase with increase in shear strength of the material and ultrasonic vibration amplitude. The observations have been rationalized based on interfacial heating at asperities due to adiabatic plastic deformation.

Original languageEnglish
Pages (from-to)1650-1657
Number of pages8
JournalJournal of Materials Processing Technology
Volume211
Issue number10
DOIs
Publication statusPublished - 2011 Oct

Keywords

  • Adiabatic heating
  • Bonding
  • Dynamic recrystallisation
  • Thermal transients
  • Ultrasonic additive manufacturing
  • Welding

ASJC Scopus subject areas

  • Ceramics and Composites
  • Computer Science Applications
  • Metals and Alloys
  • Industrial and Manufacturing Engineering

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