Thermal stress measurement in silicon chips encapsulated in IC plastic packages under temperature cycling

Hideo Miura, Makoto Kitano, Asao Nishimura, Sueo Kawai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Thermal stress in silicon chips encapsulated in IC plastic packages is discussed. A stress sensing chip which can detect the three-dimensional stress components separately is developed. The thermal stress occurs in the silicon chip almost linearly with temperature at the steady state. The stress path with temperature during heating is the same as that during cooling. On the other hand, during temperature cycling, stress hysterisis is observed, and the stress increases gradually with increasing cycles. The stress increase phenomenon occurs due to the viscoelastic phenomenon of the molding compounds. The stress increase-ratio is determined by the relationship between the cycle period and the stress relaxation time of the molding compounds at temperatures of interest.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, EEP
PublisherPubl by ASME
Pages957-963
Number of pages7
ISBN (Print)0791807665
Publication statusPublished - 1992 Dec 1
Externally publishedYes
EventProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA
Duration: 1992 Apr 91992 Apr 12

Publication series

NameAmerican Society of Mechanical Engineers, EEP
Volume2

Other

OtherProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
CityMilpitas, CA, USA
Period92/4/992/4/12

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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  • Cite this

    Miura, H., Kitano, M., Nishimura, A., & Kawai, S. (1992). Thermal stress measurement in silicon chips encapsulated in IC plastic packages under temperature cycling. In American Society of Mechanical Engineers, EEP (pp. 957-963). (American Society of Mechanical Engineers, EEP; Vol. 2). Publ by ASME.