Thermal properties and microstructure of zirconia/monazite-type LaPO 4 composites for powder preparation methods

Seung Ho Kim, Tohru Sekino, Takafumi Kusunose, Ari T. Hirvonen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Thermal conductivity and microstructure of 3YSZ/monazite-type LaPO 4 composites were investigated. Powders were prepared by two kinds of preparation methods such as conventional ball-milled and chemical precipitation of LaPO4 on the zirconia powder surface. Thermal conductivity of 3YSZ/monazite-type LaPO4 composites was lower than that of 3YSZ. That of 3YSZ/monazite-type LaPO4 composites was influenced on the powder preparation methods and as a function of measured temperature. Microstructure of 3YSZ/monazite-type LaPO4 composites was not much affected by the amount of dispersed LaPO4 particles. 3YSZ/monazite-type LaPO 4 composites were observed to pores after thermal etched. The pore of synthesized specimens was observed remarkably in compared with conventional ball-milled specimens.

Original languageEnglish
Title of host publicationEco-Materials Processing and Design VIII - ISEPD-8, Proceedings of the 8th International Symposium on Eco-Materials Processing and Design
PublisherTrans Tech Publications Ltd
Pages909-912
Number of pages4
ISBN (Print)0878494316, 9780878494316
DOIs
Publication statusPublished - 2007
Event8th International Symposium on Eco-Materials Processing and Design, ISEPD-8 - Kitakyushu, Japan
Duration: 2007 Jan 112007 Jan 13

Publication series

NameMaterials Science Forum
Volume544-545
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other8th International Symposium on Eco-Materials Processing and Design, ISEPD-8
CountryJapan
CityKitakyushu
Period07/1/1107/1/13

Keywords

  • Microstructure
  • Monazite
  • Thermal barrier coating
  • Thermal conductivity
  • YSZ

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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