Thermal Management Technique Using Control of Thermal Radiation Spectrum for Encapsulated Electronic Devices

Shinichiro Tsuda, Makoto Shimizu, Fumitada Iguchi, Hiroo Yugami

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


The role of thermal management has been critical in the design of electronic devices. This issue is especially important in handheld electronic devices. Here, we investigate a new thermal management technique that controls thermal radiation spectrum using a 2-D periodic microstructure. In this technique, heat generated from an electronic device in the form of thermal radiation directly enters the ambient environment without absorption by external packages such as resin. In this paper, radiative heat transfer in the encapsulated-electronic-device model is experimentally evaluated to clearly show the effect of the proposed technique. This effectiveness of the technique for reducing the temperature of electronic devices and external packages is demonstrated. Moreover, the cooling effect of the technique is clearly observed as the contribution of the radiative heat transfer is increased. This paper suggests that thermal radiation is effective for thermal management of electronic devices in small spaces.

Original languageEnglish
Article number7150359
Pages (from-to)971-979
Number of pages9
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number7
Publication statusPublished - 2015 Jul 1


  • Controlling thermal radiation spectrum
  • Thermal management.
  • handheld electronic devices
  • microstructure
  • radiative heat transfer

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering


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