Thermal management design for GMR head ESD-robustness

Y. Ohsawa, T. Funayama, H. Sakata, H. Yoda, M. Sahashi

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


The effect of Spin Valve (SV) resistance, SV/lead contact resistance, heat conductance and heat capacitance of SV, and the blocking temperature of anti-ferromagnetic (AF) material in the SV on electrostatic discharge (ESD)-voltage was studied with test-elements in which the lead structure and the AF film were varied. Reducing SV/lead contact resistance by means of using lead-overlaid structure showed the largest effect on ESD-robustness among those factors.

Original languageEnglish
Pages (from-to)2613-2615
Number of pages3
JournalIEEE Transactions on Magnetics
Issue number5 PART 1
Publication statusPublished - 1999
Externally publishedYes


  • Blocking temperature
  • Contact resistance
  • ESD
  • GMR
  • Lead-overlaid structure

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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