Thermal expansion coefficient and thermal fatigue of discontinuous carbon fiber-reinforced copper and aluminum matrix composites without interfacial chemical bond

Grégory Lalet, Hiroki Kurita, Jean Marc Heintz, Guillaume Lacombe, Akira Kawasaki, Jean François Silvain

Research output: Contribution to journalArticle

28 Citations (Scopus)

Abstract

Fully dense carbon fiber-reinforced copper and aluminum matrix (Cu-CF and Al-CF) composites were fabricated by hot press without the need for an interfacial chemical compound. With 30 vol% carbon fiber, the thermal expansion coefficients (TECs) of pure Cu and Al were decreased to 13.5 × 10 -6 and 15.5 × 10-6/K, respectively. These improved TECs of Cu-CF and Al-CF composites were maintained after 16 thermal cycles; moreover, the TEC of the 30 vol% Cu-CF composite was stable after 2500 thermal cycles between -40 and 150 °C. The thermal strain caused by the TEC mismatch between the matrix and the carbon fiber enables mechanical enhancement at the matrix/carbon fiber interface and allows conservation of the improved TECs of Cu-CF and Al-CF composites after thermal cycles.

Original languageEnglish
Pages (from-to)397-402
Number of pages6
JournalJournal of Materials Science
Volume49
Issue number1
DOIs
Publication statusPublished - 2014 Jan 1

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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