Thermal conductivity of silicon nanowire using landauer approach for thermoelectric applications

Ming Yi Lee, Min Hui Chuang, Yiming Li, Seiji Samukawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The electronic and phononic band structure of silicon nanowires embedded in SiGeo.3 is calculated and used to investigate its effect on the thermoelectric properties by Landauer approach. The contribution from elec-Tron/hole on power factor and electronic thermal con-ductance is less than that from phonons on lattice ther-mal conductance.

Original languageEnglish
Title of host publicationProceedings of 2019 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019
EditorsFrancesco Driussi
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728109404
DOIs
Publication statusPublished - 2019 Sep
Event24th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019 - Udine, Italy
Duration: 2019 Sep 42019 Sep 6

Publication series

NameInternational Conference on Simulation of Semiconductor Processes and Devices, SISPAD
Volume2019-September

Conference

Conference24th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019
Country/TerritoryItaly
CityUdine
Period19/9/419/9/6

Keywords

  • Landauer Approach
  • Silicon Nanowire
  • Ther-moelectric

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Science Applications
  • Modelling and Simulation

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