Thermal conductivity of intermetallic compounds with metallic bonding

Yoshihiro Terada, Kenji Ohkubo, Tetsuo Mohri, Tomoo Suzuki

Research output: Contribution to journalArticle

41 Citations (Scopus)

Abstract

Thermal conductivity is one of the key parameters required for high-temperature structural applications of metallic materials. In this overview, the thermal conductivity of intermetallic compounds are extensively described based mainly on our past works, since there had been less works in this research field. Emphasis is placed on the B2 and the L12 compounds with metallic bonding such as NiAl, Ni3Al, etc., which have been attracting attention for engineering applications at higher temperatures. The thermal conductivity data have been accumulated for the intermetallic compounds, and the phenomenological aspects are reviewed in detail as a function of alloy composition, constituent and temperature. The Wiedemann-Franz law is applicable to the intermetallic compounds, indicating that the carrier of thermal conduction is an electron rather than a phonon. The thermal conductivity of an intermetallic compound with the ordered crystal structured is characterized as an enhancement due to ordering with reference to the basic contribution of solid solution with the disordered crystal structure. It is demonstrated that the thermal conductivity of intermetallic compounds is reduced by the addition of a third element, and this subject is also covered.

Original languageEnglish
Pages (from-to)3167-3176
Number of pages10
JournalMaterials Transactions
Volume43
Issue number12
DOIs
Publication statusPublished - 2002 Dec

Keywords

  • B2
  • Intermetallic compound
  • L1
  • Microalloying
  • Thermal conductivity

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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