Thermal-aware memory system synthesis for MPSoCs with 3D-stacked hybrid memories

Chia Yin Liu, Yi Jung Chen, Masanori Hariyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Integrating Multi-Processor System-on-Chips (MPSoCs) and memories vertically by Through-Silicon Vias (TSVs) provides abundant memory bandwidth, but the increase of power density also makes the system frequently work under thermal emergent states. Although several thermal-aware TSV placement methods have been proposed to ease the thermal issue from the architectural design points of view, the overlooking of designing the type of stacked memories and memory interface in synergy may lead to thermal inefficient designs. The stacked memories may be SRAMs, DRAMs, or even NVMs, and they are divergent in power, performance, and thermal behavior, which in turn would greatly affect the memory interface design, i.e. TSV placements. In this paper, we propose the first thermal-aware memory system synthesis method for MPSoCs with 3D-stacked hybrid memories. The proposed method synergistically synthesizes the type of stacked memories and the memory interface aiming at optimizing performance while the thermal constraint is met. The results show that, among all the tested cases, the proposed method successfully keep peak temperature under 85°C with at most 29% of performance degradation.

Original languageEnglish
Title of host publication35th Annual ACM Symposium on Applied Computing, SAC 2020
PublisherAssociation for Computing Machinery
Pages546-553
Number of pages8
ISBN (Electronic)9781450368667
DOIs
Publication statusPublished - 2020 Mar 30
Event35th Annual ACM Symposium on Applied Computing, SAC 2020 - Brno, Czech Republic
Duration: 2020 Mar 302020 Apr 3

Publication series

NameProceedings of the ACM Symposium on Applied Computing

Conference

Conference35th Annual ACM Symposium on Applied Computing, SAC 2020
CountryCzech Republic
CityBrno
Period20/3/3020/4/3

Keywords

  • 3D-stacked hybrid memories
  • MPSoCs
  • System-level synthesis
  • Thermal efficiency
  • Thermal-aware design

ASJC Scopus subject areas

  • Software

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