Thermal analysis of multi-pass laser irradiation on fused silica

Peng Yao, Chuanzhen Huang, Jun Wang, Tsunemoto Kuriyagawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A rough ground fused silica surface can be ground in a ductile mode by ultra-precision grinding after repairing the surface and subsurface micro cracks (SSMC) by Co2 laser irradiation. In this paper, 2D finite element thermal analysis of unidirectional multi-pass laser irradiation on fused silica was conducted, and the simulation results were compared with the thermal analysis and experiments results of single pass laser irradiation. Thermal analysis results show that the SSMC on the ground fused silica can be repaired and surface roughness can be decreased simultaneously by unidirectinal laser raster scan with a power of 10.5 W, a scan velocity of 0.2 m/s and a scan spacing of 40 μm.

Original languageEnglish
Title of host publicationAdvances in Abrasive Technology XV
Pages621-626
Number of pages6
DOIs
Publication statusPublished - 2012
Event15th International Symposium on Advances in Abrasive Technology, ISAAT 2012 - , Singapore
Duration: 2012 Sep 252012 Sep 28

Publication series

NameAdvanced Materials Research
Volume565
ISSN (Print)1022-6680

Other

Other15th International Symposium on Advances in Abrasive Technology, ISAAT 2012
CountrySingapore
Period12/9/2512/9/28

Keywords

  • Co laser irradiation
  • Fused silica
  • Raster scan
  • Repair
  • Surface and subsurface micro cracks
  • Thermal analysis

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Yao, P., Huang, C., Wang, J., & Kuriyagawa, T. (2012). Thermal analysis of multi-pass laser irradiation on fused silica. In Advances in Abrasive Technology XV (pp. 621-626). (Advanced Materials Research; Vol. 565). https://doi.org/10.4028/www.scientific.net/AMR.565.621