TY - GEN
T1 - Theoretical calculation of the reading output from a micro thermal sensors for precision positioning
AU - Shimizu, Yuki
AU - Ishida, Ayaka
AU - Matsukuma, Hiraku
AU - Gao, Wei
PY - 2019/1/16
Y1 - 2019/1/16
N2 - This paper presents a numerical analysis of heat flow in a linear encoder system, in which a micro thermal sensor is employed to read line pattern structures on a scale grating. A simple heat transfer model of the interface between the micro thermal sensor and a scale grating is established, and the heat flow at the sensor-grating interface is estimated for the cases of employing scale gratings having line pattern structures with a sinusoidal profile and a triangular profile, respectively, to search for the possibility of employing the output signal from the micro thermal sensor for displacement measurement.
AB - This paper presents a numerical analysis of heat flow in a linear encoder system, in which a micro thermal sensor is employed to read line pattern structures on a scale grating. A simple heat transfer model of the interface between the micro thermal sensor and a scale grating is established, and the heat flow at the sensor-grating interface is estimated for the cases of employing scale gratings having line pattern structures with a sinusoidal profile and a triangular profile, respectively, to search for the possibility of employing the output signal from the micro thermal sensor for displacement measurement.
KW - Displacement measurement
KW - Encoder
KW - Heat flow
KW - Micro thermal sensor
UR - http://www.scopus.com/inward/record.url?scp=85062238549&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85062238549&partnerID=8YFLogxK
U2 - 10.1109/AMCON.2018.8614751
DO - 10.1109/AMCON.2018.8614751
M3 - Conference contribution
AN - SCOPUS:85062238549
T3 - Proceedings of the 2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018
SP - 24
EP - 25
BT - Proceedings of the 2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018
A2 - Meen, Teen-Hang
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018
Y2 - 16 November 2018 through 18 November 2018
ER -