TY - GEN
T1 - Theoretical analysis of vacancy transport combined with electromigration and stress induced voiding
AU - Nemoto, Takenao
AU - Yokobori, Toshimitsu
AU - Murakawa, Tsutomu
PY - 2007/9/25
Y1 - 2007/9/25
N2 - Electromigration (EM) and stress-induced voiding have become significant in recent LSI interconnections due to the increase in current density and residual stress [1-3]. Many works have been carried out to clarify the relationship between EM and residual stress [4-6]. The present authors have reported the numerical analysis of vacancy transport based upon the mass balance equation [7]. This paper concludes that the behavior of vacancy transport by EM is influenced by residual stress. In this paper, an equation for vacancy transport is proposed to include the effect of residual stress. A computer-aided simulation and an in-situ observation test are conducted to discuss the quantitative relationship between current density and residual stress. [Keywords:.
AB - Electromigration (EM) and stress-induced voiding have become significant in recent LSI interconnections due to the increase in current density and residual stress [1-3]. Many works have been carried out to clarify the relationship between EM and residual stress [4-6]. The present authors have reported the numerical analysis of vacancy transport based upon the mass balance equation [7]. This paper concludes that the behavior of vacancy transport by EM is influenced by residual stress. In this paper, an equation for vacancy transport is proposed to include the effect of residual stress. A computer-aided simulation and an in-situ observation test are conducted to discuss the quantitative relationship between current density and residual stress. [Keywords:.
KW - Electromigration
KW - In-situ observation
KW - Numerical analysis
KW - Residual stress
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U2 - 10.1109/RELPHY.2007.369987
DO - 10.1109/RELPHY.2007.369987
M3 - Conference contribution
AN - SCOPUS:34548803554
SN - 1424409195
SN - 9781424409198
T3 - Annual Proceedings - Reliability Physics (Symposium)
SP - 634
EP - 635
BT - 2007 IEEE International Reliability Physics Symposium Proceedings, 45th Annual
T2 - 45th Annual IEEE International Reliability Physics Symposium 2007, IRPS
Y2 - 15 April 2007 through 19 April 2007
ER -