The wear mechanism of silicon nitride in rolling-sliding contact

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Abstract

The microscopic wear mechanism of silicon nitride in unlubricated rolling-sliding contact was investigated by using a ring-on-ring-type test machine at room temperature. The tangential coefficient φ was changed from 0.04 to 0.89 and the slip ratio S was changed from 0% to 100% by changing the combination of contact stress and shear stress. With these conditions the value of the wear coefficient K obtained was of the order of 10-7 to 10-3. The wear coefficient increases with increasing tangential coefficient and increasing slip ratio. The observed drastic change in wear coefficient related closely to the change in microscopic wear mode, which was evident by inspection of the wear surface with a scanning electron microscope. For S > 10% the wear surface became very rough and showed many cracks and marks of delamination of flakes, and K was larger than 10-5. For S < 10% and φ>0.3 the wear surface showed partial fracture on a scale similar to the pore size and K was of the order of 10-6. For S < 10% and φ<0.3 the wear surface clearly retained the initial pores, cracking was not observed and K was less than 10-6.

Original languageEnglish
Pages (from-to)291-300
Number of pages10
JournalWEAR
Volume151
Issue number2
DOIs
Publication statusPublished - 1991 Dec 20

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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