The wafer-level vacuum sealing and electrical interconnection using electroplated gold bumps planarized by single-point diamond fly cutting

Hideki Hirano, K. Hikichi, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

16 Citations (Scopus)

Abstract

Wafer-level vacuum sealing and electrical interconnection are often critical for microelectromechanical systems (MEMS). This article presents a packaging and integration technology, which is applicable to non-planer (i.e. microstructured) and temperature-sensitive wafers by means of single-point diamond fly cutting of electroplated Au bumps and Au-Au diffusion bonding. The process condition was optimized by L18 Design of Experiments (DOE), and the bonding force and surface pre-treatment were extracted as dominant parameters. The crystal size of the Au bump enlarges after heat treatment for degassing at 300°C, but a smaller crystal size, which is preferred for bonding, is obtained by fly cutting, as observed by electron back scattering diffraction (EBSD). Finally, 100% yield of vacuum-sealing and a high bonding shear strength were achieved.

Original languageEnglish
Title of host publication2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1283-1286
Number of pages4
ISBN (Print)9781479989553
DOIs
Publication statusPublished - 2015 Aug 5
Event18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
Duration: 2015 Jun 212015 Jun 25

Other

Other18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
CountryUnited States
CityAnchorage
Period15/6/2115/6/25

Keywords

  • Au-Au diffusion bonding
  • Electron back scattering diffraction
  • Hetero-integration
  • Single-point diamond fly cutting
  • Wafer-level vacuum sealing

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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