Phase diagrams and a thermodynamic database constructed by the Calculation of Phase Diagrams approach offer powerful tools for alloy design and materials development. This article presents recent progress on the thermodynamic database for micro-solders and copper-based alloys, which is useful for the development of lead-free solders and prediction of interfacial phenomena between solders and the copper substrate in electronic packaging technology. In addition, examples of phase diagram applications are presented to facilitate the development of Co-Cr-based magnetic recording media in hard disks and new ferromagnetic shape-memory alloys.
ASJC Scopus subject areas
- Materials Science(all)