The thickness-ratio effects of Ni/Nb electrode on wire bonding strength with n-type 4H-SiC

Kunhwa Jung, Daisuke Ando, Yuji Sutou, Tetsuya Oyamada, Masamoto Tanaka, Junichi Koike

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The thickness-ratio effects of Ni/Nb bi-layer electrodes were studied for power device applications. The reaction microstructure and electrical contact property were investigated after annealing at 1000 °C and compared with the results of an Ni electrode. Microstructure-related problems of the Ni electrode could be successfully resolved without sacrificing ohmic contact behavior by the addition of Nb to a Ni based electrode. Carbon precipitation on the electrode surface was reduced with increasing Nb thickness by the formation of carbides, which led to good adhesion between the electrode and a wiring pad. High shear strength of the bonded wire was also obtained by the elimination of the carbon precipitates on the electrode surface.

Original languageEnglish
Title of host publicationSilicon Carbide and Related Materials 2011, ICSCRM 2011
EditorsRobert P. Devaty, Michael Dudley, T. Paul Chow, Philip G. Neudeck
PublisherTrans Tech Publications Ltd
Pages829-832
Number of pages4
ISBN (Print)9783037854198
DOIs
Publication statusPublished - 2012
Event14th International Conference on Silicon Carbide and Related Materials 2011, ICSCRM 2011 - Cleveland, OH, United States
Duration: 2011 Sep 112011 Sep 16

Publication series

NameMaterials Science Forum
Volume717-720
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other14th International Conference on Silicon Carbide and Related Materials 2011, ICSCRM 2011
CountryUnited States
CityCleveland, OH
Period11/9/1111/9/16

Keywords

  • Niobium
  • Ohmic contact
  • Silicon carbide
  • Wire bonding

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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