The silicon mold fabrication of a kind of micro-optical resonator and coupler

Ju Hui, Takayuki Ohta, Satoru Takao, Masafumi Ito, Minoru Sasaki, Kazuhiro Hane, Masaru Hori

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present the fabrication of a kind of hexagonal and triangular cavity mold, which can cast Polymethyl Methacrylate (PMMA) resonators and couplers. The mold is designed on (111) silicon wafer according to its crystal structure and anisotropic etching properties in the etchant of ethylene diamine, pyrocatechol, and water (EDP/EPW), forming sidewalls by six {110} crystal surfaces, which are perpendicular to the (111) plane and constitute precise hexagons and triangles. The RIE-ICP etching is used to define the depth of the triangle and hexagonal cavities, and the following EDP etching smoothes the sidewalls of cavities. Only high temperature EDP etching is proved to be able to get smooth sidewalls. Before etching, the wafer is aligned to the right crystal orientation by pre-etched marks. The etched results of different geometrical cavities are analyzed and discussed based on the crystal structure.

Original languageEnglish
Title of host publicationMicromachining Technology for Micro-Optics and Nano-Optics V and Microfabrication Process Technology XII
DOIs
Publication statusPublished - 2007 May 24
EventMicromachining Technology for Micro-Optics and Nano-Optics V and Microfabrication Process Technology XII - San Jose, CA, United States
Duration: 2007 Jan 222007 Jan 24

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6462
ISSN (Print)0277-786X

Other

OtherMicromachining Technology for Micro-Optics and Nano-Optics V and Microfabrication Process Technology XII
Country/TerritoryUnited States
CitySan Jose, CA
Period07/1/2207/1/24

Keywords

  • (111) silicon wafer
  • EDP etching
  • Hexagonal cavity
  • RIE-ICP etching
  • Triangle coupler

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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