The latest package and assembly technology for SiC power module'

Yoshikazu Takahashi, Hiroyuki Nogawa, Akira Morozumi, Yoshitaka Nishimura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

It is expected to be effective for global environmental conservation and energy saving that power electronics technology introduce to a variety of areas of electric power conversion system, such as electric and hybrid electric vehicle (EV/HEV), IT/CPU power supply, general inverter, electric power grid, and electric train. To meet these trends, the performance of Si power devices have been improving up to their performance limitation derived from material properties of Si. On the other hand, silicon carbide (SiC) power devices have been widely researched and developed because of their superior material properties as power device. This paper presents packaging and assembly technologies for new SiC devices which can improve the performances of power electronics systems.

Original languageEnglish
Title of host publication2016 IEEE CPMT Symposium Japan, ICSJ 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-4
Number of pages4
ISBN (Electronic)9781509020379
DOIs
Publication statusPublished - 2016 Dec 28
Externally publishedYes
Event2016 IEEE CPMT Symposium Japan, ICSJ 2016 - Kyoto, Japan
Duration: 2016 Nov 72016 Nov 9

Publication series

Name2016 IEEE CPMT Symposium Japan, ICSJ 2016

Other

Other2016 IEEE CPMT Symposium Japan, ICSJ 2016
CountryJapan
CityKyoto
Period16/11/716/11/9

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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